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Boston Chapter Meeting

May 2 @ 10:00 am - 12:00 pm

The chapter plans a kickoff meeting on May 2. Attendance is free. Please RSVP to mike@pcea.net


Time: 10 a.m. to 12 p.m.

Location: University of Massachusetts – Lowell North Campus

Alumni Hall room 102

54 University Ave., Lowell, MA

The speakers are Gopu Achath of EMA Design Automation on supply chain-driven circuit design and Paul Yang of Jove PCB on embedded inductor technology. Contact Mike Buetow at mike@pcea.net for details.

Parking: There is limited parking in the Cumnock Lot (31 University Ave.) near Alumni Hall. Additional parking is available in the North Parking Garage (293 Riverside St.). A map of the campus is here: https://www.uml.edu/maps


Our guest speakers and topics are:

  1. Gopu Achath, vice president of technology, EMA Design Automation: “Supply Chain-Driven Circuit Design”
  2. Paul Yang, senior FAE manager, JOVE PCB: “Embedded Inductor Technology”



  • “Supply Chain-Driven Circuit Design”

Traditionally ECAD users weren’t integrated or involved in the supply chain. With the rising challenges in semiconductor industry around chip shortages, however customers have realized the need for integrating ECAD with supply chains. Last-time buy and purchasing decisions have moved upstream to ECAD designers. Learn how to validate design components and select components for your designs based on part availability, lifecycle status and most importantly lead time all from within the design tool. We will demonstrate how to make supply chain resilience an essential part of the design process.

  • “Embedded Inductor Technology”

With the rapid development of artificial intelligence and autonomous driving technology, miniaturization, integration, and modularization are the general trend of electronic product design, especially in chip power supply. Designers are looking for higher efficiency, higher power density, better reliability, and smaller package sizes.

The inductors of tertiary power modules that power CPUs and GPUs usually occupy a large surface area, making it challenging to deploy more chips and small-sized resistor and capacitors. Thanks to the development of copper-iron cofiring integrated inductor technology, inductors can be embedded into the PCB and copper plating makes connections and fanout. In some ways, it is the first packaging by PCB embedded technology, which can solve this problem well.




May 2
10:00 am - 12:00 pm
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University of Massachusetts – Lowell North Campus
54 University Ave.
Lowell, MA United States
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