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PCEA-EIPC ‘Design to Fabrication’ Technical Symposium
May 7
$75The EIPC (European Institute for the PCB Community) and PCEA will cohost a “Design to Fabrication” Technical Symposium this spring in several Baltic states.
The new event is scheduled to take place on May 7,8 and 9 in the following cities: Copenhagen, Stockholm and Tallinn.
The presentations include:
• Alun Morgan, Ventec – PCB Materials
• Rick Hartley, RHartley Enterprises – Differential Pair Routing for SI and EMI Control
• Tarja Rapala, EIPC – Ultra-HDI Manufacturing
• Steven Driver, JIVA Materials – Sustainability
The symposium is designed for designers and other professionals involved in the electronics and fabrication industries. It will provide valuable insights, technical discussions, and networking opportunities for all attendees.
Ventec and JIVA Materials are among the sponsors for the event. Limited sponsorships remain available.
Registration will be open shortly at eipc.org.