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PCEA Webinar: Thermal Management of Hybrid PCBs

February 27 @ 1:00 pm - 2:00 pm

This webinar takes place Feb. 27 from 1 to 2 pm EST. Register here.

This month our special member webinar is on high-performance PCB materials for thermal management. On Feb. 27, Chris Hanson, Pesh Patel and Chad Wood will deliver a one-hour talk on thermal IMS (insulated metal substrate). The term “IMS” refers to PCBs built on a metal (typically aluminum but also copper), which acts as a thermal substrate, while the dielectric adhesive (prepreg) provides high thermal transfer from the components while maintaining dielectric insulation. They can be used to replace direct bonded copper (DBC) substrates for power modules and devices.

This webinar will dive into the cutting-edge technologies shaping the landscape of multilayer hybrid PCB (printed circuit board) designs, with a specific focus on high performance thermal laminate and prepreg materials. As electronic devices continue to evolve, the demand for PCBs with enhanced thermal management and reliability has become paramount. This webinar will provide a comprehensive overview of the characteristics, applications, and advantages of thermal laminate and prepreg materials in the context of hybrid PCBs.
The discussion will cover the fundamental properties of thermal laminate materials, highlighting their thermal conductivity, dielectric strength, and mechanical stability. Attendees will gain insights into how these materials contribute to the effective dissipation of heat in electronic assemblies, thus optimizing the overall performance and lifespan of electronic devices.
Furthermore, the webinar will explore the role of thermal bond prepreg materials in hybrid PCB designs. Thermal prepregs, or pre-impregnated resin systems, play a crucial role in bonding layers of a PCB’s together to maximize thermal transfer reliably, and cost effectively. The session will elaborate on the different types of thermal bond and prepreg materials available, their resin content, and how they impact the overall reliability and manufacturability of hybrid PCB’s.
Attendees will have the opportunity to engage in a Q&A session with experts in the field, fostering a deeper understanding of the challenges and opportunities associated with incorporating these advanced materials into hybrid PCB designs.
In conclusion, this webinar serves as a valuable resource for engineers, designers, and professionals in the electronics industry seeking to stay abreast of the latest developments in hybrid PCB technology focused on thermal management. Join us to explore the intricate world of thermal laminate and prepreg materials and their transformative impact on the future of electronic device design and manufacturing.

(Note: Adding the calendar reminder does not register you for the webinar.)



February 27
1:00 pm - 2:00 pm
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