A five-day course covering the basics of the profession, materials, manufacturing methods and processes; circuit definition and capture; board layout data and placement; circuit routing and interconnection; signal-integrity and EMI applications; flex PCBs; documentation and manufacturing preparation; and advanced electronics (energy movement in circuits, transmission lines, etc.). Written by Mike Creeden, Rick Hartley, Susy Webb, [...]
Many digital designers and signal integrity engineers grapple with high frequency signal integrity problems when their systems run at extremely fast edge rates. Some fundamental concepts from RF PCB design are helpful for identifying the cause of design problems and devising solutions. Learn more in this special two-hour webinar. This seminar is not commercial and [...]
Join Rick Hartley in a a new two-hour presentation on identifying reasonable rules and guidelines, as well as proper PCB layout concepts to ensure that double data rate (DDR) structures function as intended without adding extra time or cost to the project. This seminar is not commercial and will not promote any specific brand of [...]
Abstract: Engineering teams worldwide are facing increasingly difficult challenges to design electronic products and achieve good signal integrity and compliance. However, the status quo had become to expect the design to fail EMC testing, not just once, but three, four, or as many as five times. Each time the design is sent to be retested, [...]
Speaker: Gerry Partida and Gil White of Summit Interconnect Gerry Partida is vice president of technology at Summit Interconnect. He has managed tooling and planning of over 40,000 PCB designs over his Gil White is a senior field applications engineer with more than 40 years of industry experience, including more than 20 years with microvia [...]
This 40-hour course was developed by leading experts in printed circuit engineering layout with a combined 250+ years of industry experience. The course covers approximately 70 major topics under the following headings: Basics of the profession, materials, manufacturing methods and processes, project management, circuit definition, schematic capture, board layout data and placement, circuit routing, High [...]
International Electronics Circuit Exhibition (Shenzhen)
Presentation: Establishing Design Rules for the Laser Depaneling of Printed Circuit Boards, by Stephan Schmidt Microsoft Teams meeting https://teams.live.com/meet/9311318863142?p=iEDtJq19EPVEEVq7 Meeting ID: 931 131 886 314 2 Passcode: UWY4pP
Material parameters and properties that determine the temperature of a trace, how these are calculated, and show results of some simulations of vias of varying widths and amps.
Final date to submit an abstract for the PCB West 2024 technical conference for electronics design, fabrication and assembly.
This 40-hour course was developed by leading experts in printed circuit engineering layout with a combined 250+ years of industry experience. The course covers approximately 70 major topics under the following headings: Basics of the profession, materials, manufacturing methods and processes, project management, circuit definition, schematic capture, board layout data and placement, circuit routing, High [...]
