Monday, June 2
9:00 a.m. – 10:00 a.m.
Design Guidelines Associated with Unique RF Features
John Johnson, American Standard Circuits
Many RF boards have cavities and/or edge plating. Cavity PCBs have structural recesses to enable additional functionality and can be seen in a number of different RF applications. These types of features permit insertions of heat sinks. The inner cavity surface can also be used for electrical contact, normally a ground connection. Edge plating may be required to improve EMI shielding and/or improve chasis ground in electronic systems.
This presentation will discuss various design considerations associated with these specific features.
Who should attend: PCB Designer/Design Engineer, System Designer, Hardware Engineer, Fabricator Engineer/Operator, Assembly Engineer/Operator
Level of complexity: Basic, Intermediate
9:00 a.m. – 11:30 a.m.
Embedded Capacitance Laminates in PCBs Impact on EMC, SI, and PI
Robert Carter, Oak-Mitsui
The increase in data rates and processing speeds driven by AI, next-generation digital and RF device complexity, require more precise filtering, improved signals, and power with less noise. This discussion will focus on the newest studies showing how including ultra-thin and high Dk laminates in PCBs improve space utilization, stack-up thicknesses, EMC, SI and PI.
Who should attend: PCB Designer/Design Engineer, System Designer, Hardware Engineer, Fabricator Engineer/Operator, Assembly Engineer/Operator
Level of complexity: Beginner, Intermediate
10:30 a.m. – 11:30 a.m.
TBA
12:00 p.m. – 1:00 p.m.
Lunch-and-Learn
1:30 p.m. – 5:30 p.m.
Low Layer Count and IoT PC Board Design
Rick Hartley, RHartley Enterprises
Circuit boards for the automotive, handheld device and IoT (Internet of Things) worlds are often driven by the need for low cost (driving very low-layer-count), moderate-to-high part density, mixed-signal applications, low power dissipation and sometimes a transmit / receive antenna. This combination of needs makes PCB design an extreme challenge. Creating 1, 2 or 4-layer PCBs with excellent signal integrity and low noise/interference and no EMI issues can, by itself, be a very serious challenge. A little of the ˜right’ know-how makes the challenge much easier.
This 3.5-hour course will discuss and define:
• Frequency concerns in digital and analog PCBs
• Transmission line setup in 1, 2 and 4-layer PCBs
• Avoiding energy spread in low-layer-count PCBs
• Signal Integrity and EMI control in low-layer-count PCBs
• Power distribution and decoupling in low-layer-count PCBs
• Antenna design and setup in and on the PCB
• A short primer in cost savings at PCB fabrication.
Who should attend: PCB Designer/Design Engineer, System Designer, Hardware Engineer, Fabricator Engineer/Operator
Level of complexity: Basic, Intermediate
1:30 p.m. – 3:30 p.m.
Using AI in Hardware and PCB Design
Ethan Pierce, Dodec Labs
Engineering and design teams are increasingly driven to integrate AI technologies that:
• Use LLMs, neural networks, and reinforcement learning
• Accelerate design workflows (schematic, layout) and reduce time-to-market.
• Reduce cost across the design cycle
• Reduce risk and minimize errors in complex design tasks.
• Keep their teams and business ahead of the competition.
The purpose of this master class is to equip designers and engineers with the knowledge to accelerate their workflows using AI tools. This no-nonsense course focuses on leveraging AI tools in the hardware design workflow. We will explore the time and resources involved in a typical design process and then dive into each of these processes to demonstrate how the presented tools can accelerate workflows across all ecosystems, such as automotive, defense and medical. For the sake of familiarity, this class will build on popular open-source projects. While specific vendors will be mentioned, our focus will be on the frameworks for interacting with these tools.
This course will equip participants with the knowledge to alleviate fears that these tools will replace us, and instead show how they can become valuable allies. Once equipped with this knowledge, participants can approach their hardware design cycles with the enhanced capabilities of AI-driven workflows. Additionally, this course presents a pattern of thinking that helps keep pace with technological advancements, preparing you to evaluate the effectiveness of new tools as they emerge.
This course is for:
• All levels of electrical engineers
• All levels of PCB designers
• Product development teams
Included in the course we will introduce:
• A no-nonsense approach with practical examples and workflows on how to integrate AI into current design processes for all design ecosystems
• Establishing knowledge and frameworks that will apply to current and future AI tools
• Methods that apply to the entire hardware design cycle – libraries, schematics, layout, and BoMs
• Understanding the real limitations of the tools and what’s to come.
Who should attend: PCB Designer/Design Engineer, System Designer, Hardware Engineer, CEO/COO/Sales/Marketing
Level of complexity: Beginner, Intermediate
4:00 p.m. – 5:30 p.m.
The Most Common Design Errors Caught by Fabrication
Mike Tucker, Millennium Circuits & Ray Fugitt, DownStream Technologies
In preparation for this presentation, we talked to many of the largest PCB manufacturers in the US and abroad. We then developed a list of the most common errors found on incoming designs. We look at each of the errors and discuss ways to find them before the designs are sent out for manufacturing.
Methods we will look at include netlist comparison, design for manufacturing, and design rule analysis. We also talk about proper documentation needed for PCB manufacturing. We encourage attendee participation and ask folks to bring their challenges for discussion. After this seminar, the PCB designer will take back some knowledge to better assist them in using their existing tools in the market to produce better and more accurate designs.
Who should attend: PCB Designer/Design Engineer, Fabricator Engineer/Operator
Target audience: Beginner, Intermediate, Advanced
5:30 p.m. – 6:30 p.m.
Welcome Reception
Tuesday, June 3
9:00 a.m. – 10:00 a.m.
Flex/Rigid Flex: Materials, DFM and Cost Impacts
Dave Lackey, American Standard Circuits
Flex and rigid flex are a significantly growing portion of the global PCB market. Whether you are starting with a simple flex design or a complex rigid-flex design, this presentation will give a different perspective.
Among the topics addressed:
• The benefits of flex circuits
• Types of flex circuits
• Flex material options and selection criteria
• Unique DfM considerations for flex/rigid-flex PCBs
• Considerations while designing cost-effective flex circuits
• How changes in designs impact cost/manufacturing and reliability.
Who should attend: PCB Designer/Design Engineer, Fabricator Engineer/Operator
Target audience: Beginner, Intermediate
9:00 a.m. – 10:00 a.m.
PCB Cost Drivers
Michael Marshall, NCAB Group
Many aspects of a printed circuit board (PCB) determine its cost. The specifications drive the manufacturing process. In turn, this affects PCB price and sustainability.
This presentation provides insight of how PCBs are priced according to the fabrication drawing and Gerber data. Hard cost drivers, such as size, material, and build complexity cannot always be changed, but could have a bigger impact on the cost. Soft cost drivers like over-specification, lead times, and transportation may also have a great effect on the price. An understanding of the cost drivers will help engineers plan a more sustainable PCB for the future.
Who should attend: PCB Designer/Design Engineer, CEO/COO/Sales/Marketing
Target audience: Intermediate
10:00 a.m. – 12:00 p.m.
HDI Via Design: Planning the Energy Pipelines
Daniel Beeker, NXP Semiconductor
This session will focus on the challenges posed by using HDI vias, from the perspective of layer transitions and power delivery. The example will be using a 12-layer PCB to discuss the requirements for signal layer transitions. Via stackups will be defined to enable good signal integrity. Power delivery and the via structures necessary will also be addressed. A must-see class for anyone planning to use this technology.
Who should attend: PCB Designer/Design Engineer, Hardware Engineer, SI Engineer, Test Engineer
Level of complexity: Beginner, Intermediate, Advanced
10:00 a.m. – 12:00 p.m.
Designing Complex PCBs
Stephen Chavez, Siemens
Designing complex PCBs is a multifaceted and challenging task that plays a pivotal role in the development of advanced electronic systems. This presentation explores the key considerations, methodologies, and emerging trends in the field of complex PCB design. The complexity of modern electronic devices demands intricate PCB layouts to accommodate high-density components, diverse functionalities, and stringent performance requirements.
We will delve into the critical aspects of layout solvability, signal integrity and electromagnetic interference, power integrity and power distribution, thermal management, and manufacturability, emphasizing the need for a holistic and systematic approach.
We will also address the incorporation of EDA tools to enhance the efficiency and reliability of complex PCBs. As the demand for smaller form factors and increased functionality rises, designers face the challenge of optimizing space utilization while minimizing electromagnetic interference and signal crosstalk. We will explore strategies for mitigating these challenges, including the use of automation in placement and routing to include simulation and DfM tools.
Furthermore, we will discuss the role of collaboration between hardware and software teams in achieving successful complex PCB designs. The integration of design for manufacturability (DfM) and design for testability (DfT) principles is highlighted as essential for streamlining the production process and ensuring reliability of the final product. The evolution of Industry 4.0 and the Internet of Things (IoT) introduces new dimensions to complex PCB design, with considerations for connectivity, security and adaptability becoming increasingly important.
In conclusion, this presentation provides a comprehensive overview of the challenges and strategies involved in designing complex PCBs, emphasizing the interdisciplinary nature of the task and the need for a holistic design approach.
What you will learn:
1. The three key perspectives of success in PCB design
2. Increase productivity and proficiency with current/future EDA software (automation)
3. Benefits of implementing best practices and the cost of doing nothing (remaining status quo).
Who should attend: PCB Designer/Design Engineer, System Designer, Hardware Engineer, SI Engineer, Test Engineer, Assembly Engineer/Operator, CEO/COO/Sales/Marketing
Target audience: Beginner, Intermediate, Advanced
12:00 p.m. – 1:00 p.m.
Lunch-and-Learn
1:30 p.m. – 5:00 p.m.
Solving Routing Problems in Digital Boards
Susy Webb, Design Science
The first design rule for routing a board is that the board must work properly, so a plan that addresses good signal quality is important. The designer must consider the physics and electronics involved, find efficient ways to control the flow, consider what to route first/second, decide what layer would be best to use for each type of signal, and how to put it all together into a well-routed board.
In this presentation, we start with a bit of science to understand why it is best to route signals a particular way. We will discuss return current and planes and how to plan them effectively for best energy flow and containment. We will also talk about scenarios for effective fanout to set up channels, the potential routing order that will help critical signals, and routing schemes that will help arrange the signal flow on many layers.
Importantly, we will discuss what to do when signals and buses must change layers, as it is not just about moving the energy to a random layer, but rather understanding which layer might be best to move it to and why. And finally, there will be a discussion of special treatment routing for crosstalk and EMI control, which is extremely important for a quiet board.
Who should attend: PCB Designer/Design Engineer, Hardware Engineer, SI Engineer
Level of complexity: Beginner, Intermediate
1:30 p.m. – 5:30 p.m.
Circuit Grounding to Control Noise and EMI
Rick Hartley, RHartley Enterprises
When time-varying (AC) signals travel in the transmission lines of a PCB, state changing electric and magnetic fields are present. These fields, when not controlled, are the source of noise and EMI. ICs with very fast rise time outputs have made problems common, even in circuits clocked at low frequencies. Knowing all the basics of proper grounding, most of all high-quality PCB stackups, will help contain and control fields, making noise and EMI issues virtually nonexistent.
This 3.5-hour course will discuss and define:
• “Grounding” defined and energy movement in a PCB
• Keys to controlling common mode energy and resulting EMI
• Cables, heat sinks, board edges and other unintended radiators
• Effects of IC style and packaging on overall grounding scheme
• Impact of connector pin out on containment of energy
• Divided planes and plane islands in the PCB
• Best PCB stackups for optimum grounding schemes
Who should attend: PCB Designer/Design Engineer, Hardware Engineer, SI Engineer
Level of complexity: Beginner, Intermediate, Advanced
Speaker Biographies
Daniel Beeker is technical director at NXP Semiconductor, where he provides applications support and special function development tools and instrumentation for NXP Automotive customers worldwide. He has more than 43 years’ experience in electronics system design and EMC. He also specializes in EMC and signal integrity design techniques for systems and PCBs. He has completed more than 200 PCB design evaluations for customers and internal NXP products. He teaches field-based design techniques at NXP and industry conferences worldwide, more than 100 sessions with more than 5,000 attendees since 2010. He is also involved with NXP IC package design and IC development tool teams to support improved EMC performance, working on more than 20 IC designs. His unique approach to EMC is the result of many years of collaboration with one of the fathers of the industry, Ralph Morrison.
Robert Carter is vice president of marketing, business development, and technology for Oak-Mitsui’s FaradFlex ultra-thin embedded capacitance materials and support of advanced technology low loss low profile VSP copper and Micro-Thin copper. He has over 35 years of professional experience in printed circuits, advanced electronic materials, MEMs, RF modules, sensors, and chip packaging. Previously, Carter initiated the startup of two major PCB factories in China, and led engineering, development, and application organizations at companies such as Xerox, Toppan, Multi-Fineline Electronix, Rogers Corp., Flex2Chip, and Panasonic Electronic Materials. He studied chemical & materials engineering and business management at California Polytechnic University and Grand Canyon University.
Stephen Chavez, CPCD is a principal printed circuit engineer with three decades of experience. He is acknowledged throughout the industry as a global subject matter expert (SME) in PCB design. His continued career evolution has elevated him to industry though leadership and as an industry influencer regarding printed circuit engineering. He is currently principal technical product marketing manager with Siemens. He’s an editor/contributor to industry publications and host of the Printed Circuit Podcast. He is a coauthor and instructor of the PCEA Training curriculum and certification (PCEA Certified Printed Circuit Designer, or CPCD).
Ray Fugitt is technical sales manager at Downstream Technologies. He has 37 years’ printed circuit board experience, 11 at Hadco in product and CAM engineering. In 2002, he joined DownStream in technical marketing and later, technical sales positions, where he supports and provides training for the BluePrint PCB and CAM350 products.
Rick Hartley, a retired senior principal engineer at L-3 Avionics Systems, is principal of RHartley Enterprises, through which he consults and teaches internationally. His focus is on correct design of circuits and PC boards to prevent and/or resolve EMI, noise and signal integrity problems. He has consulted with major corporations in the US and 14 other countries. His career has focused on computers, telecommunications and aircraft avionics, as well as medical, automotive and appliances. He has taught seminars at numerous conferences, including the IEEE EMC Symposium, PCB West, IPC Apex Expo and others. He is on the board of directors of the Printed Circuit Engineering Association, a past member of the Editorial Review Board of Printed Circuit Design magazine and has written numerous technical papers and articles on methods to control noise, EMI and signal integrity.
Dave Lackey is vice president of business development at American Standard Circuits, He has been involved with manufacturing PCBs since 1980 and has worked in various shops, most of which had military certifications and utilized higher technology. He has extensive experience building metal-core boards and PCBs requiring thermal management solutions, as well as flex and rigid-flex boards. He has a strong engineering background and is knowledgeable in most industry technologies.
John Johnson is director of business development at American Standard Circuits. Prior to that, he held vice president roles in sales, customer support and applications engineering at Averatek, and spent 15 years at Electrotek, a Wisconsin PCB fabricator.
Mike Marshall is a field applications engineer at NCAB Group USA in the North Central regional office. He has 40 years of experience in the PCB industry. His career began with PCB manufacturing processes and development including process engineering, equipment development, plating processes engineering, photoimaging techniques, and NC-drill/route programing. Later in his career, he went on to develop experience in PCB assembly and electromechanical assembly operations in QA management before joining NCAB Group in 2019.
Ethan Pierce is the founder of Dodec Labs. An electrical engineer by trade, he has spent his career building, consumer, medical, and defense connected products at leading companies from Apple to leading IoT companies Blues Wireless and Particle. His specialty is maintaining holistic design intent from concept to mass production, producing high performance hardware designs.
Mike Tucker is director of engineering and technology at Millennium Circuits (MCL). He has over 27 years; technical experience in PCB manufacturing (rigid/rigid-flex/HDI/flex/MPCB). He has been responsible for the development and implementation of manufacturing processes and methodologies to drive the company’s technology curve, capabilities, and competitiveness. He is an expert in front-end engineering, CAM tools, automation of CAM tooling, integration of CAM tools with MRP/ERP/shop-floor operations and software development of shop-floor software operations. He works closely with engineers, designers, program managers and OEMs to build mission critical parts from concept to prototype to production.
Susy Webb, CID, is a senior PCB designer with 40 years of experience. Her career includes experience in coastal and oceanographic oil exploration and monitoring equipment, point-to-point microwave network systems, and CPCI and ATX computer motherboards. Webb is a regular speaker at PCB East and PCB West, and international design conferences, and consults for individual companies and PCEA chapters. Her presentations discuss practical implementation of complex engineering concepts into board layout and methods to improve the overall design and flow of printed circuit boards. She is CID certified, a former writer/columnist for PCD&F, a chapter writer for Clyde Coombs’ Printed Circuits Handbook, and one of the judges for the annual TLA competition. Webb is also an active member of the PCEA Executive Board and education committee and is a member and past president of the Houston Chapter of the Designers Council.
